KM1712HK-JSW双组份导电银胶
PRODUCT DESCRIPTION 产品描述
KM1712HKA/B is an epoxy adhesive for electric connection
where room temperature cure is required.
It has following advantages.
KM1712HK A/B是一款双组分环氧体系的室温固化导电胶。
KM1712HK A/B具有以下优势：
² Electrically conductive 导电性
² High thermal conductive 高导热
² Thixotropic 触变性
² Ease of use 易于使用体积
² Good bond strength 粘结性好
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能 | Test Method 测试方法 | Resin-A 环氧树脂-A | Hardener-B 固化剂-B | Mixed-A/B 混合物-A/B |
Color/Appearance 颜色/外观 | Visual 目测法 | Silver 银色 | Silver 银色 | Silver 银色 |
Specific Gravity, g/cm3比重 | ASTM D-792 | 5.2 | 5.0 | 5.1 |
Viscosity @ 25°C, cps 粘度（25°C） | ASTM D-2393 | Thixotropic 触变膏体 | Thixotropic 触变膏体 | Thixotropic 触变膏体 |
TYPICAL CURED PROPERTIES 固化后属性
Cured 7 days @ 25 ºC (77ºF)（固化七天@25 ºC）
Property 性能 | value 数值 |
Flexural strength 挠曲强度,psi | 10200 |
Tensile lap shear strength,psi@ 25 ºC | 1100 |
Thermal Conductivity 导热率, W/M-K | 25 |
Max. service temperature 最大工作温度, ºC | 90 |
Min. service temperature 最小工作温度, ºC | -40 |
Volume resistivity 体积电阻率, ohms-cm | 0.0006 |
MIX RATIO 混合比例
Resin/Hardener Ratio (by weight) 树脂与固化剂重量比 | 100 / 100 |
Resin/Hardener Ratio (by volume) 树脂与固化剂体积比 | 100 / 100 |
Pot Life (100 gram mass), 25°C, minutes 操作时间（100g）25°C，分钟 | 60 |
CURING TIME TABLE 固化进度表
Temperature 温度 | Minimum Cure Time 最少固化时间 |
25 ºC (77ºF) | 16-24 hours |
65 ºC (149ºF) | 3 hours |
100 ºC (212ºF) | 45 minutes |
SHELF METHOD 保存方法
Store at 25 ºC in a dry place. After each use, tightly reseal. 每次用完后，应密封保存于25ºC的干燥地方。
SHELF LIFE储藏寿命
Provided this material is stored under the recommended storage conditions in their original containers,
it will remain in useable condition for half year from date of MADE.
采用原始包装，保存于15 - 30 ºC的干燥地方，保质期为半年（从生产日算起）。
