田村 低银锡膏GP-217-HF17衡鹏

田村 低银锡膏GP-217-HF17 衡鹏企业竭诚为您供应 1. Outstanding Features 3) Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing. * Inspected the flux itself only reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB without cleaning. LFSOLDER GP-217-HF17 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is Table 1 - The characteristics of LFSOLDER GP-217-HF17 1) Pb-free (Sn/Ag/Cu series) alloy solder is used. 2) Excellent wettability for electronic component and land pattern. 4) Excellent solderability is brought with the reflow profile with high peak temperature. 5) Superior reliability is ensured without cleaning the flux residue. Items Characteristics Test methods Alloy composition Sn 96.1 / Ag 1.0 / JIS Z 3282 (1999) Melting point 211??222?? DSC measurement Particle size of solder 20??36μm Laser diffraction method Shape of solder powder Spherical Annex 1 to JIS Z 3284 (1994) Flux content 12.5% JIS Z 3284 (1994) Chlorine content* 0.0% JIS Z 3197 (1999) Viscosity 200 Pa??s Annex 6 to JIS Z 3284 (1994)